Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645828 | In situ plasma wafer bonding method | Brian Roberds | 2003-11-11 |
| 6534381 | Method for fabricating multi-layered substrates | Nathan W. Cheung, William G. En, Mikhail Korolik | 2003-03-18 |