Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6646081 | Polyarylene compositions with enhanced modulus profiles | James P. Godschalx, Qing Shan J. Niu, Kenneth J. Bruza, Paul H. Townsend, III | 2003-11-11 |
| 6630390 | Method of forming a semiconductor device using a carbon doped oxide layer to control the chemical mechanical polishing of a dielectric layer | Ebrahim Andideh | 2003-10-07 |
| 6552129 | Process of rheology modification of polymers | David A. Babb, Che-I Kao, Wendy Hoenig, Michael E. Rowland, H. Craig Silvis +2 more | 2003-04-22 |
| 6548399 | Method of forming a semiconductor device using a carbon doped oxide layer to control the chemical mechanical polishing of a dielectric layer | Ebrahim Andideh | 2003-04-15 |
| 6528136 | Rheology modification of polymers prepared using metallocenes | Thoi H. Ho, Wendy Hoenig, Che-I Kao, Michael E. Rowland, Michael J. Mullins +1 more | 2003-03-04 |
| 6521306 | Rheology modification of low density polyethylene | Wendy Hoenig, Teresa P. Karjala, Li-Min Tau, Michael J. Mullins, H. Craig Silvis +1 more | 2003-02-18 |
| 6506848 | Rheology modification of elastomers | Wendy Hoenig, Teresa P. Karjala, Che-I Kao, Michael J. Mullins, H. Craig Silvis +1 more | 2003-01-14 |