Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576491 | Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame | Bo Soon Chang, Anthony Odejar | 2003-06-10 |
| 6562272 | Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages | Bo Soon Chang, Annie X. Tan | 2003-05-13 |