Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649447 | Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames | Dagmar Beyerlein | 2003-11-18 |
| 6576491 | Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame | Vani Verma, Anthony Odejar | 2003-06-10 |
| 6562272 | Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages | Vani Verma, Annie X. Tan | 2003-05-13 |