Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6544817 | Method for sawing a moulded leadframe package | Lee Kock Huat, Chan Boon Meng, Phuah Kian Keung, Lee Huan Sin | 2003-04-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6544817 | Method for sawing a moulded leadframe package | Lee Kock Huat, Chan Boon Meng, Phuah Kian Keung, Lee Huan Sin | 2003-04-08 |