CM

Chan Boon Meng

📍 Ipoh, MY: #2 of 5 inventorsTop 40%
Overall (2003): #248,615 of 273,478Top 95%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6544817 Method for sawing a moulded leadframe package Lee Kock Huat, Phuah Kian Keung, Lee Huan Sin, Cheong Mun Tuck 2003-04-08