Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667229 | Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip | Charles W. C. Lin | 2003-12-23 |
| 6608374 | Semiconductor chip assembly with bumped conductive trace | Charles W. C. Lin | 2003-08-19 |
| 6576493 | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps | Charles W. C. Lin | 2003-06-10 |
| 6537851 | Method of connecting a bumped compliant conductive trace to a semiconductor chip | Charles W. C. Lin | 2003-03-25 |