Issued Patents 2003
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667229 | Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip | Cheng-Lien Chiang | 2003-12-23 |
| 6660626 | Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint | — | 2003-12-09 |
| 6653742 | Semiconductor chip assembly with interlocked conductive trace | — | 2003-11-25 |
| 6653217 | Method of connecting a conductive trace to a semiconductor chip | — | 2003-11-25 |
| 6653170 | Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit | — | 2003-11-25 |
| 6627824 | Support circuit with a tapered through-hole for a semiconductor chip assembly | — | 2003-09-30 |
| 6624030 | Method of fabricating power rectifier device having a laterally graded P-N junction for a channel region | Paul Chang, Geeng-Chuan Chern, Wayne Y. W. Hsueh, Vladimir Rodov | 2003-09-23 |
| 6608374 | Semiconductor chip assembly with bumped conductive trace | Cheng-Lien Chiang | 2003-08-19 |
| 6593224 | Method of manufacturing a multilayer interconnect substrate | — | 2003-07-15 |
| 6583040 | Method of making a pillar in a laminated structure for a semiconductor chip assembly | — | 2003-06-24 |
| 6576539 | Semiconductor chip assembly with interlocked conductive trace | — | 2003-06-10 |
| 6576493 | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps | Cheng-Lien Chiang | 2003-06-10 |
| 6562709 | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint | — | 2003-05-13 |
| 6562657 | Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint | — | 2003-05-13 |
| 6551861 | Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive | — | 2003-04-22 |
| 6548393 | Semiconductor chip assembly with hardened connection joint | — | 2003-04-15 |
| 6544813 | Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment | — | 2003-04-08 |
| 6537851 | Method of connecting a bumped compliant conductive trace to a semiconductor chip | Cheng-Lien Chiang | 2003-03-25 |
| 6511865 | Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly | — | 2003-01-28 |
| 6509639 | Three-dimensional stacked semiconductor package | — | 2003-01-21 |