Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660135 | Staged aluminum deposition process for filling vias | Sang Ho Yu, Yonghwa Chris Cha, Shri Singhvi, Fufa Chen | 2003-12-09 |
| 6521107 | Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life | Seshadri Ramaswami | 2003-02-18 |