Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660700 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | Ma. Fatima Seijo, David Bernhard, Long Nguyen | 2003-12-09 |
| 6599870 | Boric acid containing compositions for stripping residues from semiconductor substrates | George Guan, Long Nguyen | 2003-07-29 |
| 6566315 | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures | Ma. Fatima Seijo, Dave Bernhard, Long Nguyen | 2003-05-20 |
| 6527819 | Polishing slurries for copper and associated materials | Thomas H. Baum, Long Nguyen, Cary Regulski | 2003-03-04 |