Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6541871 | Method for fabricating a stacked chip package | Chung-Hao Lee, Pao-Hei Chang Chin, Meng-Hui Lin, Song Wang | 2003-04-01 |
| 6503776 | Method for fabricating stacked chip package | Chih-Min Pao, Kuang-Hui Chen | 2003-01-07 |