ML

Meng-Hui Lin

AE Advanced Semiconductor Engineering: 1 patents #16 of 38Top 45%
📍 New Taipei, TW: #95 of 327 inventorsTop 30%
Overall (2003): #159,630 of 273,478Top 60%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6541871 Method for fabricating a stacked chip package Tsung-Ming Pai, Chung-Hao Lee, Pao-Hei Chang Chin, Song Wang 2003-04-01