Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6458705 | Method for forming via-first dual damascene interconnect structure | Vencent Chang, I-Hsiung Huang, Ya Hui Chang | 2002-10-01 |
| 6337269 | Method of fabricating a dual damascene structure | I-Hsiung Huang, Jiunn-Ren Hwang | 2002-01-08 |