Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6458705 | Method for forming via-first dual damascene interconnect structure | Kuei-Chun Hung, I-Hsiung Huang, Ya Hui Chang | 2002-10-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6458705 | Method for forming via-first dual damascene interconnect structure | Kuei-Chun Hung, I-Hsiung Huang, Ya Hui Chang | 2002-10-01 |