Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6415974 | Structure of solder bumps with improved coplanarity and method of forming solder bumps with improved coplanarity | — | 2002-07-09 |
| 6391758 | Method of forming solder areas over a lead frame | Randy H. Y. Lo | 2002-05-21 |
| 6348401 | Method of fabricating solder bumps with high coplanarity for flip-chip application | Chih-Shun Chen, Chao-Dung Suo, Ke Yang, Feng-Lung Chien | 2002-02-19 |