Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6348401 | Method of fabricating solder bumps with high coplanarity for flip-chip application | Chao-Dung Suo, Jui-Meng Jao, Ke Yang, Feng-Lung Chien | 2002-02-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6348401 | Method of fabricating solder bumps with high coplanarity for flip-chip application | Chao-Dung Suo, Jui-Meng Jao, Ke Yang, Feng-Lung Chien | 2002-02-19 |