Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492256 | Method for forming an interconnect structure with air gap compatible with unlanded vias | Shih-Wei Sun | 2002-12-10 |
| 6492732 | Interconnect structure with air gap compatible with unlanded vias | Shih-Wei Sun | 2002-12-10 |