AI

Akira Ichida

TC Tokyo Tungsten Co.: 1 patents #1 of 6Top 20%
📍 Toyama, JP: #47 of 144 inventorsTop 35%
Overall (2002): #260,038 of 266,432Top 100%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6475429 Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same Mitsuo Osada, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa 2002-11-05