Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475429 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Akira Ichida, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa | 2002-11-05 |