Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6420782 | Vertical ball grid array integrated circuit package | Lee Teck Yeow | 2002-07-16 |
| 6387729 | Method for adhering and sealing a silicon chip in an integrated circuit package | Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan, Tuck Fook Toh +2 more | 2002-05-14 |
| 6365833 | Integrated circuit package | Min Yu Chan, Jing Sua Goh, Siu Waf Low, Boon Pew Chan, Tuck Fook Toh +2 more | 2002-04-02 |