Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6387729 | Method for adhering and sealing a silicon chip in an integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Boon Pew Chan, Tuck Fook Toh +2 more | 2002-05-14 |
| 6365833 | Integrated circuit package | Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Boon Pew Chan, Tuck Fook Toh +2 more | 2002-04-02 |