JY

Jiing-Feng Yang

TSMC: 1 patents #199 of 614Top 35%
📍 Dashulong, TW: #14 of 27 inventorsTop 55%
Overall (2002): #191,057 of 266,432Top 75%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6495469 High selectivity, low etch depth micro-loading process for non stop layer damascene etch Li-Te Lin, Li-Chih Chao 2002-12-17