HL

Hui-Chi Lin

TSMC: 1 patents #199 of 614Top 35%
Overall (2002): #202,714 of 266,432Top 80%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6479402 Method to improve adhesion of molding compound by providing an oxygen rich film over the top surface of a passivation layer Chie-Ming Yang, Jun-Yang Lai, Jiann-Liang Liou, Cheng-Yeh Shih 2002-11-12