Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479402 | Method to improve adhesion of molding compound by providing an oxygen rich film over the top surface of a passivation layer | Hui-Chi Lin, Jun-Yang Lai, Jiann-Liang Liou, Cheng-Yeh Shih | 2002-11-12 |