Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6488869 | Conductive paste, its manufacturing method, and printed wiring board using the same | Hiroaki Takezawa, Minehiro Itagaki | 2002-12-03 |
| 6465082 | Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body | Hiroaki Takezawa, Masahide Tsukamoto, Minehiro Itagaki, Hideo Hatanaka, Yasushi Fukumura +2 more | 2002-10-15 |
| 6452280 | Flip chip semiconductor apparatus with projecting electrodes and method for producing same | Tsukasa Shiraishi | 2002-09-17 |
| 6429382 | Electrical mounting structure having an elution preventive film | Kazuyoshi Amami, Hiroaki Takezawa, Tsukasa Shiraishi | 2002-08-06 |
| 6387794 | Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device | — | 2002-05-14 |
| 6376051 | Mounting structure for an electronic component and method for producing the same | Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Kazuo Eda | 2002-04-23 |
| 6372548 | Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate | Minehiro Itagaki | 2002-04-16 |
| 6372547 | Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board | Yoshifumi Nakamura, Minehiro Itagaki | 2002-04-16 |
| 6369450 | Method of producing mounting structure and mounting structure produced by the same | Kazuyoshi Amani, Tsukasa Shiraishi | 2002-04-09 |
| 6365499 | Chip carrier and method of manufacturing and mounting the same | Yoshifumi Nakamura, Minehiro Itagaki | 2002-04-02 |