Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6488869 | Conductive paste, its manufacturing method, and printed wiring board using the same | Hiroaki Takezawa, Yoshihiro Bessho | 2002-12-03 |
| 6468448 | Conductive composition, conductive adhesive, and their mounting structure | Kazuyoshi Amami, Emiko Igaki | 2002-10-22 |
| 6465082 | Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body | Hiroaki Takezawa, Masahide Tsukamoto, Yoshihiro Bessho, Hideo Hatanaka, Yasushi Fukumura +2 more | 2002-10-15 |
| 6376051 | Mounting structure for an electronic component and method for producing the same | Hiroaki Takezawa, Tsutomu Mitani, Yoshihiro Bessho, Kazuo Eda | 2002-04-23 |
| 6372548 | Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate | Yoshihiro Bessho | 2002-04-16 |
| 6372547 | Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board | Yoshifumi Nakamura, Yoshihiro Bessho | 2002-04-16 |
| 6365499 | Chip carrier and method of manufacturing and mounting the same | Yoshifumi Nakamura, Yoshihiro Bessho | 2002-04-02 |