Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6460756 | Method of applying bonding paste | Seiichi Sato, Nobuyuki Suefuji | 2002-10-08 |
| 6361831 | Paste application method for die bonding | Seiichi Sato, Hitoshi Mukojima, Nobuyuki Iwashita, Nobuyuki Suefuji | 2002-03-26 |
| 6348234 | Paste applying method | Hitoshi Mukojima, Seiichi Sato, Nobuyuki Iwashita, Nobuyuki Suefuji | 2002-02-19 |