Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6361831 | Paste application method for die bonding | Seiichi Sato, Nobuyuki Iwashita, Nobuyuki Suefuji, Mitsuru Ozono | 2002-03-26 |
| 6348234 | Paste applying method | Mitsuru Ozono, Seiichi Sato, Nobuyuki Iwashita, Nobuyuki Suefuji | 2002-02-19 |