Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6416391 | Method of demounting silicon wafers after polishing | Zbigniew J. Radzimski | 2002-07-09 |
| 6352071 | Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw | George Preece | 2002-03-05 |
| 6346460 | Low cost silicon substrate with impurity gettering and latch up protection and method of manufacture | Sergei Koveshnikov | 2002-02-12 |