RK

Ryuichi Kyomasu

SH Shinkawa: 6 patents #1 of 22Top 5%
📍 Kodaira, JP: #5 of 154 inventorsTop 4%
Overall (2002): #5,205 of 266,432Top 2%
6
Patents 2002

Issued Patents 2002

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
6491202 Wire bonding apparatus and method Fumio Miyano, Toshihiko Toyama 2002-12-10
6467673 Bonding apparatus and bonding method Satoshi Enokido, Shigeru Hayata, Toshiaki Sasano 2002-10-22
6467679 Wire bonding method Fumio Miyano, Toshihiko Toyama 2002-10-22
6464126 Bonding apparatus and bonding method Shigeru Hayata, Satoshi Enokido, Toshiaki Sasano 2002-10-15
6449516 Bonding method and apparatus Motohiko Kato 2002-09-10
6422448 Ultrasonic horn for a bonding apparatus Shinichi Nishiura 2002-07-23