FM

Fumio Miyano

SH Shinkawa: 2 patents #3 of 22Top 15%
📍 Akiruno, JP: #1 of 7 inventorsTop 15%
Overall (2002): #65,506 of 266,432Top 25%
2
Patents 2002

Issued Patents 2002

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6491202 Wire bonding apparatus and method Ryuichi Kyomasu, Toshihiko Toyama 2002-12-10
6467679 Wire bonding method Ryuichi Kyomasu, Toshihiko Toyama 2002-10-22