Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6407446 | Leadframe and semiconductor chip package having cutout portions and increased lead count | Jae Won Lee, Heui-Seog Kim | 2002-06-18 |
JK
Je Bong Kang
Overall (2002): #193,638 of 266,432Top 75%
1
Patents 2002