Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6407446 | Leadframe and semiconductor chip package having cutout portions and increased lead count | Je Bong Kang, Jae Won Lee | 2002-06-18 |
HK
Heui-Seog Kim
Overall (2002): #208,472 of 266,432Top 80%
1
Patents 2002