Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6444569 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta +2 more | 2002-09-03 |
| 6362057 | Method for forming a semiconductor device | William J. Taylor, Jr., Asanga H. Perera | 2002-03-26 |