Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6444569 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Brian G. Anthony, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca +2 more | 2002-09-03 |