Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6488573 | Polishing apparatus, polishing method and method of conditioning polishing pad | Hiroshi Tanaka, Yasuyuki Ogata, Kanji Hosoki, Eturo Morita, Seiji Harada | 2002-12-03 |
| 6398906 | Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer | Hiroshi Tanaka, Jiro Kajiwara | 2002-06-04 |