Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6499648 | Method and device for making a metal bump with an increased height | Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more | 2002-12-31 |
| 6390356 | Method of forming cylindrical bumps on a substrate for integrated circuits | Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Hui-Pin Chen, Ning Huang +4 more | 2002-05-21 |
| 6358834 | Method of forming bumps on wafers or substrates | Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Hsuan-Jui Chang, Hui-Pin Chen +4 more | 2002-03-19 |