Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6390356 | Method of forming cylindrical bumps on a substrate for integrated circuits | Wen-Lo Shieh, Fu-Yu Huang, Chia-Chieh Hu, Hui-Pin Chen, Ning Huang +4 more | 2002-05-21 |
| 6358834 | Method of forming bumps on wafers or substrates | Wen-Lo Shieh, Fu-Yu Huang, Hsuan-Jui Chang, Hui-Pin Chen, Ning Huang +4 more | 2002-03-19 |