Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426554 | Semiconductor device | — | 2002-07-30 |
| 6376278 | Methods for making a plurality of flip chip packages with a wafer scale resin sealing step | Kazumi Shinchi, Takeshi Niigaki | 2002-04-23 |