Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376278 | Methods for making a plurality of flip chip packages with a wafer scale resin sealing step | Yoshimi Egawa, Kazumi Shinchi | 2002-04-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376278 | Methods for making a plurality of flip chip packages with a wafer scale resin sealing step | Yoshimi Egawa, Kazumi Shinchi | 2002-04-23 |