Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6441319 | Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate | Martin R. Handforth, Herman Kwong, Rolf Meier | 2002-08-27 |
| 6399898 | Technique for coupling signals between circuit boards | Herman Kwong | 2002-06-04 |