Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6462957 | High performance orthogonal interconnect architecture without midplane | Herman Kwong, Bao Chau L. Nguyen, Van C. Au, Paul A. Senyshyn, Rolf Meier +3 more | 2002-10-08 |
| 6441319 | Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate | Herman Kwong, Richard R. Goulette, Rolf Meier | 2002-08-27 |