Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501175 | Semiconductor device with semiconductor chip on flexible tape | — | 2002-12-31 |
| 6432807 | Method of forming solder bumps on a semiconductor device using bump transfer plate | Hiroyuki Tsukui, Tetsuya Tao | 2002-08-13 |