Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6432807 | Method of forming solder bumps on a semiconductor device using bump transfer plate | Hiroyuki Tsukui, Chikara Yamashita | 2002-08-13 |
| 6410981 | Vented semiconductor device package having separate substrate, strengthening ring and cap structures | — | 2002-06-25 |