Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6483180 | Lead frame design for burr-free singulation of molded array packages | Jaime A. Bayan | 2002-11-19 |
| 6452255 | Low inductance leadless package | Jaime A. Bayan, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2002-09-17 |
| 6448107 | Pin indicator for leadless leadframe packages | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2002-09-10 |
| 6399415 | Electrical isolation in panels of leadless IC packages | Jaime A. Bayan, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2002-06-04 |
| 6372539 | Leadless packaging process using a conductive substrate | Jaime A. Bayan | 2002-04-16 |
| 6348726 | Multi row leadless leadframe package | Jaime A. Bayan | 2002-02-19 |