Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6467278 | Cooling for singulation of composite materials in molded semiconductor packages | Sharon Mei Wan Ko, Peng Yeen Chan | 2002-10-22 |
| 6452255 | Low inductance leadless package | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2002-09-17 |
| 6399415 | Electrical isolation in panels of leadless IC packages | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2002-06-04 |