Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6383933 | Method of using organic material to enhance STI planarization or other planarization processes | Jen Shu, Prochy Sethna | 2002-05-07 |
| 6348421 | Dielectric gap fill process that effectively reduces capacitance between narrow metal lines using HDP-CVD | Jen Shu | 2002-02-19 |