Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436730 | Microelectronic package comprising tin copper solder bump interconnections and method for forming same | Cynthia M. Melton | 2002-08-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436730 | Microelectronic package comprising tin copper solder bump interconnections and method for forming same | Cynthia M. Melton | 2002-08-20 |