Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436730 | Microelectronic package comprising tin copper solder bump interconnections and method for forming same | Theresa L. Baker | 2002-08-20 |
CM
Cynthia M. Melton
Overall (2002): #237,490 of 266,432Top 90%
1
Patents 2002