Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451127 | Conductive paste and semiconductor component having conductive bumps made from the conductive paste | Treliant Fang | 2002-09-17 |
| 6352192 | System and method to control solder reflow furnace with wafer surface characterization | Tien-Yu Lee, James Vernon Hause | 2002-03-05 |